C865 Development Kit Applications
Automated Guided Vehicle
Self-driving Vehicle for logistics
C865 Development Kit Highlights
Advance Imaging capability
Gigapixel speed ISP powered by top of the line Qualcomm® Spectra™ 480 ISP with ability to process 2 Gigapixels per second. This Gigapixel speed delivers new camera features including 8K video recording, 7 camera concurrency, capture 200-megapixel photos, and simultaneously capture 4K HDR video and 64 MP (with zero shutter lag) photos.
On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
The Qualcomm Robotics RB5 Platform supports the leading 5th generation Qualcomm AI Engine with the brand-new Qualcomm Hexagon™ Tensor Accelerator, pushing 15 trillion operations per second(TOPS) with maximum efficiency to run complex AI and deep learning workloads at the Edge.
Qualcomm® FastConnect™ 6800 Subsystem with Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g/n.
Support for 5G including 5G mmWave and sub-6 GHz based of Qualcomm® Snapdragon™ X55 5G Modem-RF System via a companion module. Using 5G technology mission critical and wide scale deployments with low end-to-end latency is possible.
Heterogenous computing with efficient power budgets
The Qualcomm Robotics RB5 platform provides powerful heterogeneous computing capabilities using the octa core Qualcomm® Kryo™ 585 CPU, powerful Qualcomm® Adreno™ 650 GPU, multiple DSPs (compute, audio, and sensor) and ISPs. The Qualcomm Robotics RB5 Platform is designed to support large industrial and enterprise robots as well as small battery-operated robots with challenging power and thermal dissipation requirements.
Flexible design options for commercialization
In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.
Qualcomm® Secure Processing Unit (SPU) offers vault-like security providing Secure Boot, Hardware root of trust , cryptographic accelerators, Qualcomm® Trusted Execution Environment and camera security. Qualcomm® Crypto Engine Core is FIPS 140-2 certified.
|Component||C865 Development Kit|
|SOM Platform||Qualcomm® QCS8250
Qualcomm® Kryo™ 585
Qualcomm® Adreno™ 650 GPU, Adreno™ 665 VPU, Adreno™ 995 DPU
Qualcomm® Hexagon™ DSP with quad HVX
Qualcomm® Spectra™ 480 image processing
|RAM||8GB, LPDDR5 (POP)|
|Storage||128 GB UFS3.0 Onboard Storage
1 x MicroSD Card Slot
|Ethernet||1 x 1GbE Ethernet|
|Wireless||WLAN 802.11a/b/g/n/ac/ax 2.4/5GHz 2x2 MIMO
on-Board WLAN Antennas
|USB||1 x USB 2.0 Micro B (Debug only)
1 x USB 3.0 Type C (OTG Mode)
2 x USB 3.0 Type A (Host Mode Only)
|Display||1 x HDMI 1.4 (Type A - full) on Board Connector|
|Audio||2 x Class-D on Board Speaker Amplifier, WSA8810
1 x on Board PDM MIC on Mainboard, 4 x on Board PDM MIC on NAV MEZZ
|Sensor||Accelerometer + Gyro Sensor|
|Expansion interfaces||Expansion connectors:
HS1:1 x 60 pin high-speed connector (SDC I/F, 1 x 4L MIPI DSI, USB 2.0, CCI I2C x2, 2L+4L-MIPI CSI)
HS2:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, SPI x 1, PCIe 3.0 gen3 1L, USB 3.0 x1, GPIO x 8)
HS3:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, 4L-MIPI CSI x1(plus 2L CSI in HS1), RF CLK x 2, 2L-PCIe 3.0 x 1, 2L-PCIe 3.0 x 1(plus PCIe 1L in HS2), 4L-MIPI DSI x 1)
LS1:1 x 40 pin low-speed connector (UART x 2, SPI, I2S/PCM, I2C x 2, GPIO x 12, DC powers)
LS2:1 x 46 pin low-speed connector (Speaker x 2, DMIC I/F x 3, CAN, I2S, GPIOs, PWM, ADC, I2C, DC powers)
LS3:1 x 46 pin low-Speed connector (SPI x 2, SSC I2C, sensor interrupt x 5, GPIOs, RTC clock, DC powers)
|LED||7 x LED Indicators
4 x User Controllable
2 x For radios (WLAN activity)
1 x Power indicator
Force USB Boot
Dip Switch x 2 (6pin+4pin)
|Power source||12 V @2.5A adapter with a DC plug inner diameter 1.75mm and outer diameter 4.75mm|
|Size||85 mm x 54 mm meets the 96boards Hardware Specifications|