C865 Development Kit
Turbox C865 Development Kit provides a feature-rich Android development platform that is designed to provide an ideal starting point for IoT products require high computing power, 5G connection, advanced camera capability, and superior graphics performance.
- Qualcomm® Snapdragon™ QCS8250 processor
- Qualcomm® Adreno™ 650 GPU, Adreno 665 VPU, Adreno™ 995 DPU
- Qualcomm® Hexagon™ DSP with quad HVX
- Qualcomm® Spectra™ 480 image processing
- Compliants with the 96Boards open hardware specification
- Supports Android 10
Applications:
C865 Development Kit Applications
Service Robot
Industrial Robot/Control
Automated Guided Vehicle
Self-driving Vehicle for logistics
Consumption/Entertainment Robot
Industrial Drone
C865 Development Kit Highlights
Advance Imaging capability
Gigapixel speed ISP powered by top of the line Qualcomm® Spectra™ 480 ISP with ability to process 2 Gigapixels per second. This Gigapixel speed delivers new camera features including 8K video recording, 7 camera concurrency, capture 200-megapixel photos, and simultaneously capture 4K HDR video and 64 MP (with zero shutter lag) photos.
On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine
The Qualcomm Robotics RB5 Platform supports the leading 5th generation Qualcomm AI Engine with the brand-new Qualcomm Hexagon™ Tensor Accelerator, pushing 15 trillion operations per second(TOPS) with maximum efficiency to run complex AI and deep learning workloads at the Edge.
Advanced connectivity
Qualcomm® FastConnect™ 6800 Subsystem with Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g/n.
Support for 5G including 5G mmWave and sub-6 GHz based of Qualcomm® Snapdragon™ X55 5G Modem-RF System via a companion module. Using 5G technology mission critical and wide scale deployments with low end-to-end latency is possible.
Heterogenous computing with efficient power budgets
The Qualcomm Robotics RB5 platform provides powerful heterogeneous computing capabilities using the octa core Qualcomm® Kryo™ 585 CPU, powerful Qualcomm® Adreno™ 650 GPU, multiple DSPs (compute, audio, and sensor) and ISPs. The Qualcomm Robotics RB5 Platform is designed to support large industrial and enterprise robots as well as small battery-operated robots with challenging power and thermal dissipation requirements.
Flexible design options for commercialization
In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.
Advance Security
Qualcomm® Secure Processing Unit (SPU) offers vault-like security providing Secure Boot, Hardware root of trust , cryptographic accelerators, Qualcomm® Trusted Execution Environment and camera security. Qualcomm® Crypto Engine Core is FIPS 140-2 certified.
| Component | C865 Development Kit | |
| SOM Platform | Qualcomm® QCS8250 Qualcomm® Kryo™ 585 Qualcomm® Adreno™ 650 GPU, Adreno™ 665 VPU, Adreno™ 995 DPU Qualcomm® Hexagon™ DSP with quad HVX Qualcomm® Spectra™ 480 image processing |
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| RAM | 8GB, LPDDR5 (POP) | |
| Storage | 128 GB UFS3.0 Onboard Storage 1 x MicroSD Card Slot |
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| Ethernet | 1 x 1GbE Ethernet | |
| Wireless | WLAN 802.11a/b/g/n/ac/ax 2.4/5GHz 2x2 MIMO on-Board WLAN Antennas |
|
| USB | 1 x USB 2.0 Micro B (Debug only) 1 x USB 3.0 Type C (OTG Mode) 2 x USB 3.0 Type A (Host Mode Only) |
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| Display | 1 x HDMI 1.4 (Type A - full) on Board Connector | |
| Audio | 2 x Class-D on Board Speaker Amplifier, WSA8810 1 x on Board PDM MIC on Mainboard, 4 x on Board PDM MIC on NAV MEZZ |
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| Sensor | Accelerometer + Gyro Sensor | |
| Expansion interfaces | Expansion connectors: HS1:1 x 60 pin high-speed connector (SDC I/F, 1 x 4L MIPI DSI, USB 2.0, CCI I2C x2, 2L+4L-MIPI CSI) HS2:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, SPI x 1, PCIe 3.0 gen3 1L, USB 3.0 x1, GPIO x 8) HS3:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, 4L-MIPI CSI x1(plus 2L CSI in HS1), RF CLK x 2, 2L-PCIe 3.0 x 1, 2L-PCIe 3.0 x 1(plus PCIe 1L in HS2), 4L-MIPI DSI x 1) LS1:1 x 40 pin low-speed connector (UART x 2, SPI, I2S/PCM, I2C x 2, GPIO x 12, DC powers) LS2:1 x 46 pin low-speed connector (Speaker x 2, DMIC I/F x 3, CAN, I2S, GPIOs, PWM, ADC, I2C, DC powers) LS3:1 x 46 pin low-Speed connector (SPI x 2, SSC I2C, sensor interrupt x 5, GPIOs, RTC clock, DC powers) |
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| LED | 7 x LED Indicators 4 x User Controllable 2 x For radios (WLAN activity) 1 x Power indicator |
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| Buttons | Power Volume Up/Down Force USB Boot Dip Switch x 2 (6pin+4pin) |
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| Power source | 12 V @2.5A adapter with a DC plug inner diameter 1.75mm and outer diameter 4.75mm | |
| Size | 85 mm x 54 mm meets the 96boards Hardware Specifications | |
| Type | Category | Document Name | Update Date |
| Public Documents | - | TurboX-C865-SOM-Product-Brief-EN.pdf | - |
| Private Documents | Get the Private Documents > | ||
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TurboX C865 Development Kit (Core Kit)
Package List: Mainboard + Qualcomm C865 SOM + power supply + USB cable
Lead Time:Shipping within 2 weeks after payment.
$1299
TurboX C865 Development Kit (Vision Kit)
Package List: TurboX C865 Core Kit + Vision mezzanine with tracking & main camera
Lead Time:Shipping within 2 weeks after payment.
$1598
