| 技术规格： |
| 平台 |
- Qualcomm® Snapdragon™ SM8250 – 64-bit octa-core Kryo™ 585 Processor
- Three high-performance Gold cores at 2.42 GHz
- One high-performance Gold Prime core at 2.84 GHz
- Four low-power Kryo cores at 1.8 GHz
- Qualcomm® Adreno™ 650 GPU
- Qualcomm® Hexagon™ 698 DSP
- Qualcomm® Spectra™ 480 Image Sensor Processor
|
| 内存和存储 |
- 6GB LPDDR5 PoP RAM
- 128GB UFS3.0 Flash
|
| 无线网络 |
- Qualcomm® Wi-Fi (QCA6391)11a/b/g/n/ac/ax 2.4/5.0 GHz 2×2 with MU-MIMO
- EDR
- On-board PCB trace antennas
|
| 音频 |
- Qualcomm® WCD9385 audio codec on-board
- 1x Headset headphone output
- Audio Expansion Headers
- 1x loud-speaker output
- 1x Earpiece output
- 2x Analog MIC input
- 5x Digital MIC input
|
| 视频 |
- Adreno™ VPU 665 fifth generation UHD Video Processing Unit
- Video decode up to 4K240 or 8K60
- Video encode up to 4K120 or 8K30
- Concurrent 4K60 decode and 4K30 encode for wireless display
- New computer vision processor (CVP) for object detection and tracking
|
| 显示接口 |
- 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High Speed Display Connector
- Optional Display/Expansion board mates to DSI connectors
- HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
- DisplayPort 1.4 over USB3.1 Type-C
|
| 相机接口 |
- 4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for optional camera board
- Support for 3D Camera Configuration
- Additional 2x 4-Lane MIPI CSI camera ports available on high speed expansion header
|
| 电源 |
- 12V/5A input from wall adapter (included), or battery (not included)
|
| 电源管理 |
- Qualcomm® Power and battery management (PM8250, PM8150A, PM8150B and PM8009)
|
| 操作系统 |
|
| 尺寸 |
|
| 输入输出 |
- 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
- 1x PCIe v3 2-lane to M.2 socket
- 1x microSD/UFS Card Socket
- 2x USB 3.0 Type-A host via on-board hub
- 1x USB micro-B debug UART
- Sensor expansion headers
- Low speed GPIO expansion header
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