D845 SOM

TurboX D845 SOM是基于顶级Qualcomm® 骁龙™ 845应用处理器设计,小尺寸 (60mm x 37mm),板对板连接器,预先通过认证并易于产品化的模块。该芯片配备了全新的Qualcomm® Hexagon™ 685 DSP 架构,借助增强的GPU和CPU,实现与前代相比近三倍的AI整体性能(终端侧神经网络处理)提升。 TurboX™ D845 SOM支持新的AI处理架构,高清视频4K@60fps HDR拍摄,全新的安全处理单元和更加真实的XR体验。它提供Andriod和Linux系统供开发者选择。针对高效计算需求较大的产品将是一个理想的开发平台。

产品介绍

D845 SOM应用

医学影像

智慧城市

机器人

数字标牌

AR/VR

D845 SOM硬件框图

产品规格书

分类1   分类2描述
   平台   ChipsetQualcomm® Snapdragon™ 845 processor
   CPU64-bit applications processor (Kryo 385) with 2 MB L3 cache;
Quad high-performance Kryo cores 2.649 GHz – Kryo Gold cluster with 256 kB L2 cache per core,
Kryo Gold single- core boost at 2.803 GHz;
Quad low – power Kryo cores at 1.766 GHz – Kryo Silver cluster with 128 kB L2 cache per core
   GPUQualcomm® Adreno™630 graphics processing unit(GPU) 4K 60 fps or 2 ⅹ2k 90 fps
OpenGL™ ES 3.2 + AEP , DX next, Vulkan® 1.1
OpenCL™ 2.0 full profile, RenderScript
   DSPCompute DSP with Qualcomm®Hexaron™Vector
Extensions (HVX) processor
   操作系统Android 10 / Linux
   内存和存储LPDDR4x 4GB + UFS 64GB
多媒体   显示2x MIPI-DSI 4-lane, Up to 3840*2400@60fps
   相机Qualcomm® Spectra™ 280 ISP: Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI, Dual 14-bit ISP + one Lite ISP, up to 32MP
   编码4K60 decode for H.264 High Profile, H.265 Main 10 PROFILE and VP9 Profile 2
   解码4K60 encode for H.264 High Profile,
H.265 Main 10 Profile ; 4K30 encode for VP8
连接   WIFI/BT802.11a/b/g/a/n/ac 2ⅹ2 MIMO&BT 5.0 with BLE
 接口   接口USB3.1 x 2;  PCIe2.1 x 1; PCIe3.0 x 1; SDIO 3.0ⅹ1;
TF card x 1; QUP for UART/I2C/SPI x 5, GPIO x8, MI2S x4;
尺寸   尺寸60mm x 37mm x 6.4mm
系统环境   电源+3.8V/3A Input
   运行温度-25°C ~ +75°C
   存储温度-40°C ~ 70°C
   运行湿度5 to 95% non-condensing
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