I615 SOM

TurboX I615 SOM is an industrial-grade computing module built on the Qualcomm® Dragonwing™ IQ-615 platform and packaged in the Size-L form factor (45 mm × 45 mm, 662 pads). The module integrates up to 1.1 TOPS of AI computing capability, three 4-lane MIPI-CSI camera interfaces, and one 4-lane MIPI-DSI plus DP 1.4 display output, delivering high performance and rich multimedia features within a compact footprint. The unified OSM-L package also enables customers to flexibly switch between different SoCs on the same carrier board, accelerating time-to-market.
The product is Part of the Qualcomm Product Longevity Program, ensuring supply availability through 2036. It is ideally suited for industrial scenarios with stringent demands on lifecycle and reliability, including industrial cameras and multi-view vision systems, edge AI gateways, smart HMI terminals, portable industrial inspection devices, robots, and AMRs.

Overview

TurboX I615 SOM Applications

Industrial Camera

Edge Computing

HMI Devices

Industrial Handheld

Smart Retail

TurboX I615 SOM Features

8-core Kryo™ 460 CPU
(2 × 1.9 GHz Gold + 6 × 1.6 GHz Silver)

Hexagon™ DSP with dual HVX,
up to 1.1 TOPS on-module AI

Up to 3 × 4-lane MIPI-CSI2 cameras for multi-sensor vision

I615 SOM

4K UHD video: 4K@60 playback, 4K@30 recording

4-lane MIPI-DSI plus DP 1.4 for multi-display output

USB 3.1, PCIe Gen2, GbE, SD 3.0 / eMMC 5.1

Specifications

Category Description
Platform Qualcomm® Kryo™ 460 – 64-bit application processor with a 1 MB L3 cach
Adreno graphics processing unit (GPU) 612
Adreno display processing unit (DPU) 871
Adreno video processing unit (VPU) 443 – fourth generation with support for ultra high definition (UHD)
Qualcomm Spectra 230
Memory 4GB LPDDR4x +64GB eMMC 5.1
Connectivity External Wifi Module
Display 1x 4-lane MIPI DSI
1x DP v1.4
Camera 3x 4-lane MIPI CSI
Video Video decode up to 4K60
Video encode up to 4K30
PCIE 1x 1-lane PCIe Gen2 RC / EP
USB 1x USB 3.1 Gen1 (HS+SS)
1x USB 2.0 (HS)
Interfaces 1x RGMII
1x 4-bit SD 3.0
1x QSPI
1-lane UFS2.1 Gear3
2x high speed I2S
GPIOS, QUPS, SSC QUPS
Operating Environment Operation Temperature: -40℃ ~ +85℃
Voltage 5V +/- 5%
Format OSM-L standard
Dimension 45mm x 45mm x 4.05mm
OS Support Qualcomm Linux
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