CT6490/C6490 SOM

C4290/CM4290 SOM
C7230 SOM

CT6490/C6490 SOM

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The TurboX CT6490/C6490 SOM (System on Module) is integrated with Qualcomm® Snapdragon™ 5G SoC QCM6490/QCS6490, a 6nm processor with superior performance, power efficiency, and powerful computing (14 TOPS). It supports 4K@60FPS video decoding and 4K@30FPS video encoding, Wi-Fi 6E with DBS, Long Range Bluetooth, five MIPI CSIs, as well as a rich set of peripheral interfaces, including GPIO, UART, I2C, I3C, SPI, USB 3.1 and PCIe. The CT6490/C6490 SOM is a high performance AIoT SOM for building handheld devices, industrial robots, service robots, drones and digital signage, providing customers with hardware interfaces and software SDK to validate functions and build the prototype quickly.

Overview

CT6490/C6490 SOM Applications

Rugged Handheld

Rugged Tablet

Digital Signage

Service Robot

Industrial Robot

CT6490/C6490 SOM Features

5G Sub6 for global market Comprehensive CA/MIMO and ENDC combination

Five MIPI-CSIs, compatible to support one C-PHY Camera

Long life cycle, up to 2028

CT6490/C6490 SOM

Superior computing capability (14 TOPS)

Wi-Fi 6E with DBS

BT5.2 with Long Range Bluetooth

Rich set of peripheral interfaces, e.g. PCIe 3.0, USB3.1, USB2.0

Specifications

Category C6490 CT6490-NA (Planning) CT6490-EA (Planning)
Platform Snapdragon™ QCS6490 Snapdragon™ QCM6490 Snapdragon™ QCM6490
Qualcomm® Kryo™ CPU 670 Qualcomm® Kryo™ CPU 670 Qualcomm® Kryo™ CPU 670
Qualcomm® Adreno™ GPU 642L, Adreno 633 VPU, Adreno DPU 1075 Qualcomm® Adreno™ GPU 642L, Adreno 633 VPU, Adreno DPU 1075 Qualcomm® Adreno™ GPU 642L, Adreno 633 VPU, Adreno DPU 1075
Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and
Hexagon Tensor Accelerator		 Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and
Hexagon Tensor Accelerator		 Qualcomm® Compute Hexagon™ DSP with dual HVX, Hexagon Co-processor (Hexagon CP) 2.0 and
Hexagon Tensor Accelerator
Qualcomm® Spectra™ 570L image processing Qualcomm® Spectra™ 570L image processing Qualcomm® Spectra™ 570L image processing
Memory 4GB+64GB or 8GB+128GB 4GB+64GB or 8GB+128GB 4GB+64GB or 8GB+128GB
Air Interface NA 5G Sub6: n2/n5/n12/n14/n25/n26/n30/n41/n48/n66/n70/n71/n77/n78 5G Sub6: n1/n3/n7/n8/n20/n28/n38/n40/n41/n77/n78/n79
LTE:B2/B4/B5/B7/B12/B13/B14/B25/B26/B29/B30/B41/B46/B48/B66/B71 LTE:B1/B3/B5/B7/B8/B18/B19/B20/B26/B28A/B28B/B29/B32/B34/B38/B39/B40/B41/B42/B46
WCDMA: B1/B2/B4/B5/B6/B8/B19 WCDMA: B1/B2/B4/B5/B6/B8/B19
GNSS:GPS/Beidou/GLONASS/Galileo/NavIC/QZSS, L1/L5 bands supported GNSS:GPS/Beidou/GLONASS/Galileo/NavIC/QZSS, L1/L5 bands supported
Data Rate NA Peak Speed : 2.5Gbps DL, 550Mbps UL Peak Speed : 2.5Gbps DL,  550Mbps UL
Connectivity 802.11 ax over PCIe with DBS, 2×2 MIMO (Wi-Fi 6E), Bluetooth 5.2 802.11 ax over PCIe with DBS, 2×2 MIMO (Wi-Fi 6E), Bluetooth 5.2 802.11 ax over PCIe with DBS, 2×2 MIMO (Wi-Fi 6E), Bluetooth 5.2
Encode 4K@30FPS for H.264/H.265 4K@30FPS for H.264/H.265 4K@30FPS for H.264/H.265
Decode 4K@60FPS for H.264/H.265/VP9 4K@60FPS for H.264/H.265/VP9 4K@60FPS for H.264/H.265/VP9
Display interfaces 1x MIPI-DSI 4-lane; FHD+ (1080×2520) 8L @120FPS 1x MIPI-DSI 4-lane; FHD+ (1080×2520) 8L @120FPS 1x MIPI-DSI 4-lane; FHD+ (1080×2520) 8L @120FPS
4K@60FPS display support over DisplayPort 4K@60FPS display support over DisplayPort 4K@60FPS display support over DisplayPor
Camera Interfaces 1 x MIPI-CSI 3-lane C-PHY 1 x MIPI-CSI 3-lane C-PHY 1x MIPI-CSI 3-lane C-PHY
4 x MIPI-CSI 4-lane D-PHY 4 x MIPI-CSI 4-lane D-PHY 4x MIPI-CSI 4-lane D-PHY
Peripherals 1 x USB 3.1 with DP, 1 x USB2.0, 1 x PCIe Gen32-lane,1 x Sound Wire, 1 x SDC for SD card, 3
xDMIC Interfaces, GPIOs, UARTs		 1 x USB 3.1 with DP, 1 x USB2.0, 1 x PCIe Gen32-lane,1 x Sound Wire, 1 x SDC for SD card, 3
xDMIC Interfaces, GPIOs, UARTs		 1 x USB 3.1 with DP, 1 x USB2.0, 1 x PCIe Gen3 2-lane,1 x  Sound Wire, 1 x SDC for SD card,
3 x DMIC Interfaces, GPIOs, UARTs
Operating Environment Operation Temperature: -25°C ~ 75°C Operation Temperature: -25°C ~ 75°C Operation Temperature: -25°C ~ 75°C
Operation  Humidity: 5%~95%, non-condensing Operation  Humidity: 5%~95%, non-condensing Operation  Humidity: 5%~95%, non-condensing
Form Factor LGA LGA LGA
Certifications FCC’’/CE’’/JATE’’/TELEC’’/KC’’ FCC’’/IC’’/GCF’’/PTCRB’’/AT&T’’/Verizon’’/T-Mobile’’ CE’’/GCF’’/KC’’/JATE’’/TELEC’’/CCC’’/SRRC’’/KT’’/KDDI’‘
Voltage 3.8V ~ 4.35V 3.8V ~ 4.35V 3.8V ~ 4.35V
Dimensions 42.5mm x 35.5mm x 2.7mm 43mm x 58mm x 3.0mm (TBD) 43mm x 58mm x 3.0mm (TBD)
Operating System Linux / Android / Windows Android 12 Android 12

’’ planning

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