Qualcomm® Snapdragon™ 865 Mobile Hardware Development Kit

The Snapdragon 865 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 865 Mobile Platform. The Snapdragon 865 Mobile Hardware Development Kit is a feature-rich Android development platform that is designed to provide an ideal starting point for creating high-performance mobile devices and applications based on the Snapdragon 865 Mobile Platform. The Dev Kit provides hardware/software vendors, developers, and engineers with next generation software technology and tools to accelerate development and testing of devices.

Applications:

Tech Specs:
Processors
  • Qualcomm® Snapdragon™ SM8250 – 64-bit octa-core Kryo™ 585 Processor
  • Three high-performance Gold cores at 2.42 GHz
  • One high-performance Gold Prime core at 2.84 GHz
  • Four low-power Kryo cores at 1.8 GHz
  • Qualcomm® Adreno™ 650 GPU
  • Qualcomm® Hexagon™ 698 DSP
  • Qualcomm® Spectra™ 480 Image Sensor Processor
Memory/Storage
  • 6GB LPDDR5 PoP RAM
  • 128GB UFS3.0 Flash
Wireless
  • Qualcomm® Wi-Fi (QCA6391)11a/b/g/n/ac/ax 2.4/5.0 GHz 2×2 with MU-MIMO
  • HS and backward compatible with 1.x, 2.x + EDR
  • On-board PCB trace antennas
Audio
  • Qualcomm® WCD9385 audio codec on-board
  • 1x Headset headphone output
  • Audio Expansion Headers
  • 1x loud-speaker output
  • 1x Earpiece output
  • 2x Analog MIC input
  • 5x Digital MIC input
Video
  • Adreno™ VPU 665 fifth generation UHD Video Processing Unit
  • Video decode up to 4K240 or 8K60
  • Video encode up to 4K120 or 8K30
  • Concurrent 4K60 decode and 4K30 encode for wireless display
  • New computer vision processor (CVP) for object detection and tracking
Display Interfaces
  • 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High Speed Display Connector
  • Optional Display/Expansion board mates to DSI connectors
  • HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
  • DisplayPort 1.4 over USB3.1 Type-C
Camera Interfaces
  • 4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for optional camera board
  • Support for 3D Camera Configuration
  • Additional 2x 4-Lane MIPI CSI camera ports available on high speed expansion header
Power Input
  • 12V/5A input from wall adapter (included), or battery (not included)
Power Management
  • Qualcomm® Power and battery management (PM8250, PM8150A, PM8150B and PM8009)
OS Support
  • Android™ 10
Size
  • 100 mm x 85 mm
I/O
  • 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
  • 1x PCIe v3 2-lane to M.2 socket
  • 1x microSD/UFS Card Socket
  • 2x USB 3.0 Type-A host via on-board hub
  • 1x USB micro-B debug UART
  • Sensor expansion headers
  • Low speed GPIO expansion header

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Snapdragon™ 865 Mobile Hardware Development Kit
The Snapdragon 865 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 865 Mobile Platform. The Snapdragon 865 Mobile Hardware Development Kit is a feature-rich Android development platform that is designed to provide an ideal starting point for creating high-performance mobile devices and applications based on the Snapdragon 865 Mobile Platform. The Dev Kit provides hardware/software vendors, developers, and engineers with next generation software technology and tools to accelerate development and testing of devices.
Lead Time:Expected to ship within 2 months after payment complete.

$1630

Display Expansion Board
The display expansion board includes a WQHD AMOLED LCD display with capacitive touch panel along with extended audio connectors, sensor connectors and a JTAG connector.
● Resolution: WQHD 2880x1440
● Display Type: AMOLED
● Capacitive touch panel
● Number of Lanes: 1x 4-lane MIPI DSI interface
● Diagonal Length: 5.99”
Lead Time:Expected to ship within 2 months after payment complete.

Qualcomm® Snapdragon™ 865 Mobile Hardware Development Kit