Qualcomm® Snapdragon™ 888 Mobile Hardware Development Kit

The Qualcomm® Snapdragon™ 888 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 888 Mobile Platform. The Snapdragon 888 Mobile HDK is a feature-rich Android development platform that is suited for Android application developers, consumer manufacturers, hardware component vendors, camera vendors, and flash chip vendors to evaluate, optimize, test, and deploy applications that can utilize the Snapdragon 888 mobile platform technology.

Comprehensive and expandable development and evaluation kit for the Snapdragon 888 Mobile Platform.

The Snapdragon 888 Mobile Hardware Development Kit provides an open-frame solution for technology companies to integrate and innovate devices based on the Snapdragon 888 Mobile Platform.

The Snapdragon 888 Mobile Hardware Development Kit is a feature-rich Android development platform that is designed to provide an ideal starting point for creating high-performance mobile devices and applications based on the Snapdragon 888 Mobile Platform. The kit includes the hardware, software tools and accessories needed to immediately begin your mobile development work.

With an advanced 5-nanometer design, Snapdragon 888 platform is engineered for innovative and intelligent on-device AI, gigapixel speed professional camera quality, desktop quality graphics, and Gigabit Class download speeds.

The Snapdragon 888 mobile development platform is designed to provide original equipment manufacturers (OEMs), hardware/software vendors, developers and engineers with next generation software technology and tools to accelerate development and testing of devices.

Snapdragon 888 Mobile Hardware Development Kit Applications

● Mobile PC's

● IP Cameras

● Smart Phones/Tablets

● Apps Development

● Hexagon DSP

● Artificial Intelligence

Kit Contents

● Single board computer (SBC) with Snapdragon 888

● 12V AC power adapter

● USB cable

● Setup guide

Display Expansion Card is an additional accessory

Development Platform

888-hdk-detail

Snapdragon 888 Main Board

888-hdk-main-board

The Snapdragon 888 main board measuring 100mm x 85mm, is where all the processing occurs.

Display Expansion Board

888-hdk-expansion-board

The display expansion board includes a FHD+ AMOLED display with capacitive touch panel along with audio connectors, sensor GenX connector, Legacy sensor connector, 20p JTAG connector and front camera card connector.

SpecificationDescription
Dimensions100mm x 85mm (main board)
CPUQualcomm ® Kryo™ 680 CPU
GPUQualcomm ® Adreno™ 660 GPU delivers up to 35% faster graphics rendering*
DSPQualcomm ® Hexagon™ 780 processor
Memory and Storage12GB LPDDR5 PoP memory 256GB UFS 3.0
ConnectivityWi-Fi: 802.11a/b/g/n/ac/ax 2.4/5GHz
Bluetooth 5.1 + NFC cardconnector reserved
Camera SupportQualcomm Spectra™ 580 image processing engine
6x MIPI CSI with support for 3D camera configuration
Display2x MIPI dual 4-lane DSI + touch panel
MultimediaHDMI 2.0 output - supports up to 4K UHD
I/O Interfaces2M.2, HDMI, 1x USB 3.1 Type C, 2x USB 3.0 Type A, 1x USB 2.0 micro-B for UART, Gigabit Ethernet, 6x MIPI-CSI, 2x MIPI dual 4-lane DSI Expansion headers for additional features
Operating SystemAndroid 11
Optional AccessoriesDisplay: 6.65” AMOLED Display (2340 x 1080) with Touch Panel
Camera Daughter Card: 16MP + 48MP + 13MP Rear Camera, TOF Sensor

* Compared to previous generations

Qualcomm Hexagon, Qualcomm Adreno, Qualcomm Spectra and Qualcomm Kryo are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

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Qualcomm ® Snapdragon™ 888 Mobile HDK Main Board
The Snapdragon 888 main board measuring 100mm x 85mm, is where all the processing occurs.
Qualcomm ® Snapdragon™ 888 Mobile HDK Main Board
The display expansion board includes a WQHD AMOLED LCD display with capacitive touch panel along with extended audio connectors, sensor connectors and secondary camera connector.

Qualcomm® Snapdragon™ 888 Mobile Hardware Development Kit