C5165 SOM

Thundercomm C5165 SOM is a small size(45mm x 56mm), production ready, pre-certified(CE, FCC, ROHS)module, powered by 7nm Qualcomm Snapdragon premium-tier processor QRB5165, supports SA/NSA dual mode 5G network with Thundercomm T55 module via PCIE interface. C5165 SOM is suitable for high performance, low power consumption, robotics or XR device. It provides pre-tested HW and SW OS/BSP, rich interfaces and valid AVLS, and reference IO board. Which can speed your product development.


C5165 SOM Applications

Service Robot

Industrial Robot/Control

Automated Guided Vehicle

Self-driving Vehicle for logistics

Consumption/Entertainment Robot

Industrial Drone

C5165 SOM Highlights

Advance Imaging capability

Gigapixel speed ISP powered by top of the line Qualcomm® Spectra™ 480 ISP with ability to process 2 Gigapixels per second. This Gigapixel speed delivers new camera features including 8K video recording, 7 camera concurrency, capture 200-megapixel photos, and simultaneously capture 4K HDR video and 64 MP (with zero shutter lag) photos.

On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine

The TurboX C5165 SOM supports the leading 5th generation Qualcomm AI Engine with the brand-new Qualcomm Hexagon™ Tensor Accelerator, pushing 15 trillion operations per second(TOPS) with maximum efficiency to run complex AI and deep learning workloads at the Edge.

Advanced connectivity

• Qualcomm® FastConnect™ 6800 Subsystem with Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g/n.
• Support for 5G including 5G mmWave and sub-6 GHz based of Qualcomm® Snapdragon™ X55 5G Modem-RF System via a companion module. Using 5G technology mission critical and wide scale deployments with low end-to-end latency is possible.

Heterogenous computing with efficient power budgets

The TurboX C5165 platform provides powerful heterogeneous computing capabilities using the octa core Qualcomm® Kryo™ 585 CPU, powerful Qualcomm® Adreno™ 650 GPU, multiple DSPs (compute, audio, and sensor) and ISPs. The TurboX C5165 platform is designed to support large industrial and enterprise robots as well as small battery-operated robots with challenging power and thermal dissipation requirements.

Flexible design options for commercialization

In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.

Advance Security

Qualcomm® Secure Processing Unit (SPU) offers vault-like security providing Secure Boot, Hardware root of trust , cryptographic accelerators, Qualcomm® Trusted Execution Environment and camera security. Qualcomm® Crypto Engine Core is FIPS 140-2 certified.

Engine for Video Analytics

Hardware acceleration for advance computer vision applications using the dedicated computer vision hardware block EVA (Engine for Video Analytics). EVA provides enhancements for CV applications with reduced latencies for real time image processing decisions under decreased power for demanding budgets freeing up the DSP, GPU, and CPU capacity for other critical AI applications.

Fast Time to commercialization

In addition to a feature packed software development tools and solutions, the platform offers solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.


Category Description
Platform Snapdragon™ QRB5165
Qualcomm® Kryo™ 585
Qualcomm® Adreno™ 650 GPU, Adreno 665 VPU, Adreno 995 DPU
Qualcomm® Hexagon™ DSP with quad HVX
Qualcomm® Spectra™ 480 image processing
Memory 8GB LPDDR5(POP)+128G UFS.
Connectivity WiFi/BT: QCA6391 (802.11 a/b/g/n/ac/ax, 2x2Mino, BT5.0)
Encode 8K@30fps (H.264/H.265/VP8)
Decode 8K@60fps (H.264/H.265/ VP8/VP9)
Display Interfaces 2x MIPI-DSI 4-lane ;Support 5040*2160@60fps
Camera Interfaces 6x MIPI-CSI, 4-lane,(2.5 Gbps per lane) supports CMOS and CCD sensors up to 64 MP sensors
Other Interfaces 1 x  Sound Wire, 2x RF connector for WiFi/BT, 2 x USB 3.1, 2 x SSC I/F for sensor, 2 x PCIE, 1 x UART, 1 x SDC for micro-SD, 6 x DMICs, 2 x Speakers, GPIOs
Operating Environment Operation Temperature: –25℃ ~ +75℃
Operation  Humidity: 5%~95%, non-condensing
Voltage 3.8V ~ 4.2V
Dimension 45 x 56 x 9mm B2B Connector
OS Support Linux
You've just added this product to the cart: