Qualcomm® Robotics RB5 Development Kit

Based on the Qualcomm® QRB5165 Robotics SoC, the Qualcomm® Robotics RB5 Development kit contains a robotics-focused development board and compliant with the 96Boards open hardware specification which supports a broad range of mezzanine-board expansions for rapid prototyping.

  • Contains advanced robotics platform Qualcomm® QRB5165 processor.
  • Supports widely used Linux based distributions for robotics applications.
  • Supports multiple SDKs and tools, including Qualcomm® Neural Processing SDK for AI, Qualcomm® Robotics Vision SDK, Qualcomm® Computer Vision SDK, Qualcomm® Hexagon™ DSP SDK, Robotics Operating System (ROS) 2, and multiple Linux distributions.
  • Comprehensive set of demo applications and tutorials to accelerate development of robotics applications.
  • Compliants with the 96Board, support for sensors such as multiple cameras, depth sensing solution, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range, multi-mic and additional sensors like IMU, pressure sensor, magnetometer etc.
  • Multiple interfaces and I/Os which can connect multiple sensors.

RB5 Learning Resources >   |  RB5 Sample Apps >

Applications:

Qualcomm® Robotics RB5 Development Kit

The world's first 5G and AI-enabled robotics platform

Qualcomm® Robotics RB5 Development Kit

Unboxing Video

The Qualcomm® Robotics RB5 platform is the most innovative platform bringing together Qualcomm Technologies broad expertise in 5G and AI to empower developers and manufacturers to create the next generation of high-compute, low-power robots and drones for the consumer, enterprise, defense, industrial and professional service sectors – and the comprehensive Qualcomm Robotics RB5 Development Kit helps ensure that developers have the customization and flexibility they need to make their visions a commercial reality. With 4G and 5G connectivity speeds via a companion module, the Qualcomm Robotics RB5 platform helps pave the way for the proliferation of 5G in robotics and intelligent systems.

The Qualcomm Robotics RB5 Platform supports the development of smart, power-efficient and cost-effective robots by combining high-performance heterogeneous compute, Qualcomm® Artificial Intelligence (AI) Engine for on-device machine learning, computer vision, vault-like security, multimedia, Wi-Fi and cellular connectivity solutions to help solve common robotics challenges.

Robotics RB5 Development Kit Applications

Service Robot

Industrial Robot/Control

Automated Guided Vehicle

Self-driving Vehicle for logistics

Consumption/Entertainment Robot

Industrial Drone

Robotics RB5 Development Kit Highlights

Advance Imaging capability

Gigapixel speed ISP powered by top of the line Qualcomm® Spectra™ 480 ISP with ability to process 2 Gigapixels per second. This Gigapixel speed delivers new camera features including 8K video recording, 7 camera concurrency, capture 200-megapixel photos, and simultaneously capture 4K HDR video and 64 MP (with zero shutter lag) photos.

On-device intelligence powered by Qualcomm Artificial Intelligence (AI) Engine

The Qualcomm Robotics RB5 Platform supports the leading 5th generation Qualcomm AI Engine with the brand-new Qualcomm Hexagon™ Tensor Accelerator, pushing 15 trillion operations per second(TOPS) with maximum efficiency to run complex AI and deep learning workloads at the Edge.

Advanced connectivity

  • Qualcomm® FastConnect™ 6800 Subsystem with Wi-Fi 6 (802.11ax), 802.11ac Wave 2, 802.11a/b/g/n.
  • Support for 5G including 5G mmWave and sub-6 GHz based of Qualcomm® Snapdragon™ X55 5G Modem-RF System via a companion module. Using 5G technology mission critical and wide scale deployments with low end-to-end latency is possible.

Heterogenous computing with efficient power budgets

The Qualcomm Robotics RB5 platform provides powerful heterogeneous computing capabilities using the octa core Qualcomm® Kryo™ 585 CPU, powerful Qualcomm® Adreno™ 650 GPU, multiple DSPs (compute, audio, and sensor) and ISPs. The Qualcomm Robotics RB5 Platform is designed to support large industrial and enterprise robots as well as small battery-operated robots with challenging power and thermal dissipation requirements.

Flexible design options for commercialization

In addition to a feature packed development kit, the platform offers a range of solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.

Advance Security

Qualcomm® Secure Processing Unit (SPU) offers vault-like security providing Secure Boot, Hardware root of trust , cryptographic accelerators, Qualcomm® Trusted Execution Environment and camera security. Qualcomm® Crypto Engine Core is FIPS 140-2 certified.

High Resolution depth sensing

Robust depth sensing solution infused with an inertial measurement unit (IMU) using depth camera.

Tracking Camera

Perception and Navigation using Tracking Camera Sensor module to do visual simultaneous localization and mapping (vSLAM).

Engine for Video Analytics

Hardware acceleration for advance computer vision applications using the dedicated computer vision hardware block EVA (Engine for Video Analytics). EVA provides enhancements for CV applications with reduced latencies for real time image processing decisions under decreased power for demanding budgets freeing up the DSP, GPU, and CPU capacity for other critical AI applications.

Fast Time to commercialization

In addition to a feature packed software development tools and solutions, the platform offers solutions for commercialization from off-the-shelf System-on-Module (SoM) solutions to speed commercialization, to the flexibility for chip-on-board designs for cost-optimization at scale.

Qualcomm® Sensing Hub

Qualcomm® Sensing Hub delivers scalable sensor framework at ultra low power supporting multiple sensors and 3rd party algorithms.

Comprehensive development kit

The kit includes the robotics-focused development board, compliant with the 96Boards open hardware specification for supporting a broad range of mezzanine-board expansions and range of sensor support like camera sensor, depth camera, time-of-flight, multi-mic support, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range and support for additional sensors like IMU, pressure sensor etc.

Compatible With

Specifications of the Qualcomm® Robotics RB5 Development Kit

Component Qualcomm® Robotics RB5 Development Kit
SOM Platform Qualcomm® QRB5165
Qualcomm® Kryo™ 585
Qualcomm® Adreno™ 650 GPU, Adreno™ 665 VPU, Adreno™ 995 DPU
Qualcomm® Hexagon™ DSP with quad HVX
Qualcomm® Spectra™ 480 image processing
RAM 8GB, LPDDR5 (POP)
Storage 128 GB UFS3.1 Onboard Storage
1 x MicroSD Card Slot
Ethernet 1 x 1GbE Ethernet
Wireless WLAN 802.11a/b/g/n/ac/ax 2.4/5GHz 2x2 MIMO
n-Board WLAN Antennas
USB 1 x USB 2.0 Micro B (Debug only)
1 x USB 3.0 Type C (OTG Mode)
2 x USB 3.0 Type A (Host Mode Only)
Display 1 x HDMI 1.4 (Type A - full) on Board Connector
Audio 2 x Class-D on Board Speaker Amplifier, WSA8810
1 x on Board PDM MIC on Mainboard, 4 x on Board PDM MIC on NAV MEZZ
Sensor Accelerometer + Gyro Sensor (TDK ICM-42688/ ICM-42688-P) Barometric Pressure
Camera Vision kit IMX577 l * (only support in Qualcomm® Robotics RB5 Vision Kit.)
GMSL l *
OV9282 l * (only support in Qualcomm® Robotics RB5 Vision Kit.)
Accessories Nuvoton® (ToF) – Sensor[MN34906]
Intel® RealSense (D435i)
Expansion interfaces Expansion connectors:
HS1:1 x 60 pin high-speed connector (SDC I/F, 1 x 4L MIPI DSI, USB 2.0, CCI I2C x2, 2L+4L-MIPI CSI)
HS2:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, SPI x 1, PCIe 3.0 gen3 1L, USB 3.0 x1, GPIO x 8)
HS3:1 x 60 pin high-speed connector (4L-MIPI CSI x 2, 4L-MIPI CSI x1(plus 2L CSI in HS1), RF CLK x 2, 2L-PCIe 3.0 x 1, 2L-PCIe 3.0 x 1(plus PCIe 1L in HS2), 4L-MIPI DSI x 1)
LS1:1 x 40 pin low-speed connector (UART x 2, SPI, I2S/PCM, I2C x 2, GPIO x 12, DC powers)
LS2:1 x 46 pin low-speed connector (Speaker x 2, DMIC I/F x 3, CAN, I2S, GPIOs, PWM, ADC, I2C, DC powers)
LS3:1 x 46 pin low-Speed connector (SPI x 2, SSC I2C, sensor interrupt x 5, GPIOs, RTC clock, DC powers)
LED 7 x LED Indicators
4 x User Controllable
2 x For radios (WLAN activity)
1 x Power indicator
Buttons Power
Volume Up/Down
Force USB Boot
Dip Switch x 2 (6pin+4pin)
Power source 12 V @2.5A adapter with a DC plug inner diameter 1.75mm and outer diameter 4.75mm
Size 85 mm x 54 mm meets the 96boards Hardware Specifications

* only support in Qualcomm® Robotics RB5 Vision Kit.

Attention Please:Please Download SDK Manager to install OS for the first time. For detail information, please contact the service team: service@thundercomm.com

Type Category Document Name Update Date
Public Documents Hardware Quick Start Guide -
Depth Camera Hardware User Guide: 1.D435i Datasheet   2.Video Tutorials -
Qualcomm® Robotics RB5 Platform Hardware Reference Guide -
Software Qualcomm®_Robotics RB5 software reference manual -
Private Documents Get the Private Documents >

Everything You Need to Generate System Image

 

RB5 SDK Manager provides an end-to-end image generation/downloading solution for developers to work with RB5 devices.


Highlights

• Generate system image on local PC

• Version control of official image releases

• Flash full build into RB5 device

• Designed for developers

System Requirements

• Host OS: Ubuntu Desktop 18.04

• Alternative: Ubuntu 18.04 on Docker

NOTE: Ubuntu under libvirt KVM/QEMU is not supported

What’s in RB5 SDK Manager

• SDK Manager debian package

• README (User guide)

• Dockerfile for generating Ubuntu 18.04 docker image


Release Note for Updated Image:

Release note for LE image Release note for LU image
QC releases TC customized releases QC releases TC customized releases
QRB5165.LE.1.0-210617:
Enable WLAN, Multimedia features, Robotics features…
Including:
Camera: EIS, LDC, sHDR, 7 cameras concurrencies
Audio: PA, ALSA & TinyALSA, Audio_HAL, SVA, FluencePro
Video: Encode/Decode, 24 sessions of video
Display: Weston/wayland, HDMI
Graphics: OpenGLES, OpenCL
Sensor: IMU
ML/CV: Tflite, FastCV
Robotics: Ros2.0, Docker
QRB5165.LE.1.0-210805:
1. Based on Qualcomm release r00011.2
2. Enable Dynamic Kernel Module feature
QRB5165.UBUN.1.0-211112:
1. Updated to Qualcomm release r00012.1
QRB5165.1.0.0.0.012.1_Post-CS5.r003006_debug:
1. Based on Qualcomm release r00012.1
2. Enable 5G support on T55
3. Improve ethernet throughput
4. Debug mode with debug logs enabled
QRB5165.UBUN.1.0-210512:
1. Updated to Qualcomm release r00009.1
2. Update NON-HLOS
QRB5165.1.0.0.0.012.1_Post-CS5.r003006_perf:
1. Based on Qualcomm release r00012.1
2. Enable 5G support on T55
3. Improve ethernet throughput
4. Performance mode with debug log disabled
QRB5165.UBUN1.0-210320:
1. Updated to Qualcomm release r00008.1
QRB5165.UBUN.1.0.0.0.009.1_r003005:
1. Based on Qualcomm release r00009.1
2. Enable 5G Module for Japan&Korea
3. Enable PWM Fan
Notes: please refer to Qualcomm official release notes for complete support lists of QC releases

Release Note for SDK Manager

New Features in SDK manager v2.1.0:

-Enable LE SDK toolchain download

New Features in SDK manager v2.0.0:

- Commands to download LE releases

New Features in SDK manager v1.2.0:

- Update README

New Features in SDK manager v1.1.0:

- Modify flash method

- Update README

New Features in SDK Manager v1.0.1:

- Update README

- Add debug message on flashing

- Minor fixes

New Features in SDK Manager v1.0.0:

- User credential check

- Dynamic image version control

- Enable system image repack

- Enable full build flash on Ubuntu


Troubleshoot

1. Internet Timeout Issue

Internet timeout issue may happen during the image generation process. If issues like "Unable to fetch" are encountered, try to run command 1 again.

2. Apt Source issue

If the download fails, check the internet connection and the source list.

3. Device Boots Up

The device reboots after the flashing process is completed. If the sdkmanager does not detect the device, execute the followings:

1) If Ubuntu 18.04 is used on Docker, check whether "adb kill-server" is entered on the host PC before flashing image.

2) Reboot the device manually, open a new terminal window and enter 'adb shell' to check device.

3) Check if any debian packages are modified.

4. If flash process on Ubuntu systems does not work properly, copy full-build folder to a Windows PC and use Thundercomm MULTIDL_TOOL to flash the image. Refer to Here for the tool and user guide.

5. SDK manager flash issue

If issue like 'qdl failed, sahara failed' is encountered, enter the following command on host machine before restart the flash.

Get Support

Help Center

Technical Support

(for cusmtomer)

F&Q

No, you need to use SDK manager to flash firmware to the board.
Qualcomm® Robotics RB5 Core Kit
Mainboard + Qualcomm QRB5165 SOM + power supply + USB cable
Lead Time:Expected to ship within 5 weeks after payment complete.
Qualcomm® Robotics RB5 Vision Kit
Qualcomm® Robotics RB5 Core Kit + Vision mezzanine with tracking & main camera
Lead Time:Expected to ship within 5 weeks after payment complete.

Qualcomm® Robotics RB5 Development Kit:

Vision Mezz package
The delta between core kit and vision kit, used to easily build up vision kit on top of core kit.
Lead Time:Expected to ship within 5 weeks after payment complete.
TDK Mezzanine Board
The TDK Mezzanine Board includes all the latest technologies offerings from TDK focused on the Robotics industry. The TDK Mezzanine combines the market leading performance of the ICM-42688-P IMU with the World’s Highest Performing Digital Microphone (T5818) and TDK’s Ultrasonic Time-of-Flight (ToF) range finder (CH-101 and CH-201). These sensors are accompanied by TDK’s Motor Driver (HVC4420F-B1), Barometric Pressure (ICP-10111), and TDK’s newest industrial grade IMU Module, the IIM-46220. The TDK Mezzanine is the perfect complement to the RB5 platform and provides all the sensor data needed to help fast track development of next generation robotics.
Note: TDK Mezzanine Board require RB5 platform since it cannot work alone.
Package List: TDK Mezzanine Board + Bracket
ToF Camera for Qualcomm® Robotics RB5 Development Kit
V4T module is a 3D camera module using Nuvoton’s VGA ToF sensor (P/N MN34906). This module can be used to build prototypes of 3D imaging solutions from short to middle range . With a small form-factor and light weight, it can be seamlessly integrated to robotics platform, consumer and portable solution prototypes.
Package List: ToF Camera
5G Mezz package(Sub-6G only, Japan&Korea), Thundercomm T55M
With 5G mezzanine board and Thundercomm 5G NR module T55M-EA, offers the 5G NR Sub-6GHz connectivity in Asia on core kit or vision kit.
5G Mezz package(Sub-6G only, North America&Europe), RM502Q-AE
with 5G mezzanine board and 5G NR module RM502Q-AE, offers the 5G NR Sub-6GHz connectivity in North America and Europe on core kit or vision kit.
Heatsink with fan
thermal solution for high performance senarios
Lead Time:Shipping within 5 weeks after payment.

Accessories: