Thundercomm TurboX™ D845 SOM is a small size (60mm x 37mm) with a board to board connector, production ready and pre-certified system on module powered by the top-tier Qualcomm® Snapdragon™ 845 processor. This processor introduces new Qualcomm Hexagon 685 Vector DSP architecture, plus GPU and CPU optimizations, that together deliver up to three times faster processing of neural networks running on-device compared to the prior generation SoC. Thundercomm TurboX™ D845 SOM supports new architectures for AI, premium 4K@60fps in HDR ,new security layers and immersive XR experiences. It offers both Android and Linux OS for developers to choose. This will be an ideal platform for high computing power required embedded IoT products.
Overview
D845 SOM Applications
Medical Image
Smart City
Robot
Digital Signage
AR/VR
D845 SOM HW Block Diagram
Specifications
| Category | Item | Description |
| Platform | Chipset | Qualcomm® Snapdragon™ 845 processor |
| CPU | 64-bit applications processor (Kryo 385) with 2 MB L3 cache; Quad high-performance Kryo cores 2.649 GHz – Kryo Gold cluster with 256 kB L2 cache per core, Kryo Gold single- core boost at 2.803 GHz; Quad low – power Kryo cores at 1.766 GHz – Kryo Silver cluster with 128 kB L2 cache per core |
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| GPU | Qualcomm® Adreno™630 graphics processing unit(GPU) 4K 60 fps or 2 ⅹ2k 90 fps OpenGL™ ES 3.2 + AEP , DX next, Vulkan® 1.1 OpenCL™ 2.0 full profile, RenderScript |
|
| DSP | Compute DSP with Qualcomm®Hexaron™Vector Extensions (HVX) processor |
|
| OS | Android 10 / Linux | |
| Memory and Storage | LPDDR4x 4GB + UFS 64GB | |
| Multimedia | Display | 2x MIPI-DSI 4-lane, Up to 3840*2400@60fps |
| Camera | Qualcomm® Spectra™ 280 ISP: Support 3 x 4-lane MIPI_CSI + 1 x 2-lane MIPI_CSI, Dual 14-bit ISP + one Lite ISP, up to 32MP | |
| Decode | 4K60 decode for H.264 High Profile, H.265 Main 10 PROFILE and VP9 Profile 2 | |
| Encode | 4K60 encode for H.264 High Profile, H.265 Main 10 Profile ; 4K30 encode for VP8 |
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| Connectivity | WIFI | 802.11a/b/g/a/n/ac 2ⅹ2 MIMO |
| Interface | Interface | USB3.1 x 2; PCIe2.1 x 1; PCIe3.0 x 1; SDIO 3.0ⅹ1; TF card x 1; QUP for UART/I2C/SPI x 5, GPIO x8, MI2S x4; |
| Dimension | Size | 60mm x 37mm x 6.4mm |
| System Environment |
Power | +3.8V/3A Input |
| Operating Temp | -25°C ~ +75°C | |
| Storage Temp | -40°C ~ +70°C | |
| Relative Humidity | 5 to 95% non-condensing |
