Qualcomm® RB3 Gen 2 Development Kit

IoT development kit designed for high-performance compute, accessibility, and advanced features.

After a big success, Qualcomm® Robotics RB3 development kit now has a major upgrade. Powered by Qualcomm® QCS6490 Chipset, the Qualcomm® RB3 Gen 2 development kit is the latest development kit in the line. Compared to RB3, the performance of Gen 2 kit has been improved greatly.

• Contains advanced  platform Qualcomm® QCS6490 processor.
• Supports widely used Linux based distributions for IoT applications.
• The AI computing performance has increased by four times to an equivalent of 12 TOPS.
• Supports multiple SDKs and tools, including Qualcomm® Neural Processing SDK for AI, Qualcomm® Intelligent Multimedia Product SDK, Qualcomm® Intelligent Robotics Product SDK, Qualcomm® Hexagon™ DSP SDK, and multiple Linux distributions.
• Comprehensive set of demo applications and tutorials to accelerate development of IoT applications.
• Follows the design of the rest of RB series of products, it complaints with the 96Board, support for sensors such as multiple cameras, depth sensing solution, GMSL sensor, Ultrasonic Time-of-Flight Sensor with Extended Range, multi-mic and additional sensors like IMU, pressure sensor, magnetometer etc.
• Multiple interfaces and I/Os which can connect multiple sensors.

Applications:

The Qualcomm RB3 Gen 2 development kit provides a valuable combination of strong performance and advanced features, including powerful AI processing and computer vision, to easily create a broad range of IoT solutions across use cases including enterprise, robotics, industrial, and automation.

RB3 Gen 2 features support for Qualcomm® Linux®—a comprehensive package of OS, software, tools, and documentation precisely designed for Qualcomm Technologies' IoT platforms.

Utilizing the Qualcomm® QCS6490, the Qualcomm® RB3 Gen 2 development kits offer developers considerably increased AI processing capabilities compared to previous generations, higher inferences per second, improved power efficiency, and the ability to run more networks simultaneously. On-device machine learning combined with edge computing allows for near real-time processing for massive amounts of data.

The platform includes a development kit and software. Developers can select the development kit version that best addresses their needs, and design IoT products that demand advanced performance. The platform includes SDKs that make it easy for developers to use and integrate applications and services. The hardware development kit is also compliant with the 96Boards open hardware specification to support a range of mezzanine-board expansions, beginning with the Vision Mezzanine.

The platform includes the Qualcomm® Spectra™ ISP 570L image processing engine for the ultimate photography and videography experience, and comes with a main camera and tracking camera on the Vision Kit. It can connect to and process the output of other cameras such as stereo, depth, and Time-of-Flight (ToF). The Qualcomm® Adreno™ 633 VPU provides high-quality, UltraHD video encode and decode, while the Adreno 1075 DPU enables on-device and external UltraHD display support.

Multi-gigabit Wi-Fi 6E achieves blazing-fast wireless connectivity and low latency. Our Wi-Fi 6E offerings utilize advanced features like Qualcomm® 4K Quadrature Amplitude Modulation (QAM) and support for high-speed 160MHz channels for multi-gigabit-per-second speeds with superb stability and consistent experiences.

With the Qualcomm® Kryo™ 670 CPU and a Qualcomm® Hexagon™ processor featuring a fused AI-accelerator architecture, this solution delivers powerful connections and computing performance, and is purpose-built for industrial and commercial IoT applications such as ruggedized handhelds and tablets, human-machine interface systems, point-of-sale systems, drones, kiosks, edge AI boxes, and connected cameras.

Qualcomm® RB3 Gen 2 Development Kit Features

• Advanced ISPs for single or multiple concurrent camera experience with superior image and video capture.

• AI-accelerated workplace security and visibility.

• Blazing-fast wireless connectivity and low latency thanks to multi-gigabit Wi-Fi 6E: Up to 3.6 Gbps, 160MHz, 4K QAM, DBS with MU-MIMO and OFDMA, and WPA3-P & E.

• Superior Bluetooth® 5.2 and LE audio with crystal-clear sound, low latency, and reliability with an extended range.

• Low-speed expansion for GPIOs, I2C, SPI, UART, and/or audio.

• High-speed expansion for PCIe, USB, MIPI CSI/DSI, and/or SDIO, designed for 96Boards mezzanines.

Qualcomm® RB3 Gen 2 Development Kit Applications

Face Detection and Recognition

Inventory Management

Path Planning and 3D Map Formation

Driver Management Systems

Deep Learning

Surveillance and Security

vSLAM (Visual Localization and Mapping)

Object Detection and Avoidance

Qualcomm® RB3 Gen 2 Development Kit Block Diagram

Qualcomm® RB3 Gen 2 Development Kit

Qualcomm® RB3 Gen 2 Development Kit Contents

Core Kit:
• Development board based on the Qualcomm QCS6490 processor
• 12V wall power supply
• USB Type-C cable
• Mini speakers
• Setup guide
• Pick tool for setting switches

Vision Kit only:
• Mounting bracket for CSI cameras
• High-resolution CSI camera
• Low-resolution CSI camera

Compatible With

Specifications of the Qualcomm® RB3 Gen 2 Development Kit

Core Kit Vision Kit
Chipset QCS6490
CPU Octa-core CPU
Memory (RAM) uMCP package (6 GB LPDDR4x)
Camera 2x C-PHY/D-PHY 30-pin expansion ports on interposer board 1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP with bracket, plus additional D-PHY and GMSL-capable expansion ports
GPU Adreno 643 GPU
Video Adreno 633 VPU: 4K60 fps decode / 4K30 fps encode
Display Up to two displays supported concurrently: Full-size HDMI connector, USB Type-C supporting DP alt mode, mini-DP connector, DSI expansion
AI 12 TOPS
WLAN/Bluetooth 802.11ax with DBS, Bluetooth 5.2, two onboard printed antennas, RF expansion connectors for optional external antennas
Storage (onboard) uMCP package (128 GB UFS Flash)
Storage (external) 1x MicroSD Card Slot, PCIe expansion for NVMe
PCIe 1x PCIe Gen 3 2-lane to expansion connector, optional 1x PCIe Gen 3 1-lane to expansion connector
USB 1x USB 3.0 Type-C, 1xUSB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 on high-speed expansion
Audio 1x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors 4x DMIC, 2x digital audio amplifiers, I2S/Soundwire/DMIC expansion on low-speed connectors
Sensor IMU onboard (ICM-42688), additional expansion IMU (ICM-42688), Pressure sensor (ICP-10111), Mag sensor/compass(AK09915), additional expansion
Catagory Type Document Name
Public Documents Product Brief Qualcomm-RB3-Gen-2-Development-Kit-product-brief.pdf
Private Documents -

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Qualcomm® RB3 Gen 2 Development Kit (Core Kit)
Package List: • Development board based on the Qualcomm QCS6490 processor
• 12V wall power supply
• USB Type-C cable
• Mini speakers
• Setup guide
• Pick tool for setting switches
Lead Time: Expected to ship in the first week of July.
Qualcomm® RB3 Gen 2 Development Kit (Vision Kit)
Package List: • Qualcomm® RB3 Gen 2 Core Kit
• Mounting bracket for CSI cameras
• High-resolution CSI camera
• Low-resolution CSI camera
Lead Time: Expected to ship in the first week of July.

Qualcomm® RB3 Gen 2 Development Kit:

IMX577 Camera Module
12MP Mipi camera module, FOV:120° (D)110°(H)75°(V)
Package List: 1 x IMX 577 camera module, 1 x FPC
Heatsink with fan
thermal solution for high performance senarios

Accessories: